Qualcomm Technologies has come up with three latest smartphones namely Qualcomm Snapdragon 653, Snapdragon 626, and Snapdragon 427 SoCs in Hong Kong on Monday.
The company has also unveiled two chips in the Snapdragon 600 series including the Snapdragon 653 and the Snapdragon 626. Also, for high-volume smartphones, the company has unveiled the Snapdragon 427 chip.
Every one of the three new SoCs are minor redesigns over their forerunners that are intended to furnish arrange adaptability with the presentation of another modem, and simplicity of execution to OEMs by keeping up stick and programming similarity with past era chipsets.
Qualcomm has likewise conveyed double camera support to the three SoCs, an element stretched out interestingly past the Snapdragon 800 family to the Snapdragon 600 and Snapdragon 400 families. Every one of the three new Snapdragon SoCs don the Hexagon DSP, the Snapdragon X9 LTE modem, furthermore bolster Quick Charge 3.0. With the new modem, each of the three new SoCs likewise bolster LTE-A transporter total (2x20MHz) with up to 300Mbps pinnacle download speeds (LTE Cat. 7) and 150Mbps pinnacle transfer speeds (LTE Cat. 13), and additionally 64-QAM adjustment in the uplink. The three SoCs additionally bolster improved voice administrations (EVS) codes for Ultra HD VoLTE calls.
The Snapdragon 653 and Snapdragon 626 are somewhat more intense forms of the Snapdragon 652and Snapdragon 625 SoCs individually, and will be found in their first business gadgets before the year's over. The Snapdragon 427, a redesign on the Snapdragon 425, then again will be accessible in its first gadgets in Q1 2017.